Hot swap condensor for immersion cooling

ABSTRACT

A device for and method of hot swapping one or more electronic devices from an immersion cooling tank having a first opening, the device including a condensing device removably locatable in the first opening of the immersion cooling tank, the condensing device having a condensing coil forming a second opening through which the electronic device(s) is removable and an apparatus coupled to the condensing device for selectively adjusting a height and/or a location of the condensing device about the first opening of the immersion cooling tank.

FIELD OF THE INVENTION

The present invention relates to immersion cooling equipment,specifically to removing objects from an immersion cooling tank and,more specifically, to removing electronic or electrical equipment ordevices from a heat transfer fluid contained in an immersion coolingtank without altering the operation of other objects within theimmersion cooling tank, while minimizing the loss of heat transferfluid.

BACKGROUND OF THE INVENTION

Heat generated by electronic equipment and devices may be removed byconvection and/or conduction using, for example, a heat exchanger, animmersion cooling tank, and so forth. Heat removal by immersion coolingmay include direct and indirect methods, as well as single-and two-phaseapproaches. For example, for two-phase immersion cooling, in a firstphase, heat generated by operating electronic or electric equipment ordevices vaporizes the heat transfer fluid and/or coolant in which theelectronic or electric equipment or devices are immersed. In a secondphase, heat transfer fluid vapor produced in the immersion cooling tank,upon contact with an exterior surface of a condensing device, e.g.,condensing coils through which a cooling fluid flows at a prescribedflow rate and temperature, condenses. The condensate may then be addedback, e.g., by gravity feeding, into the immersion cooling tank.

In certain instances, a dielectric fluid may be used as the heattransfer fluid and/or coolant. Dielectric fluids have high resistivityto the transmission or conduction of electrical current, which minimizesand/or prevents electrical current from the operating electronic orelectric equipment or devices arcing and damaging other components ofthe electronic or electric equipment or devices. As a result,non-hermetically-sealed electronic equipment or devices can be immersedin a dielectric fluid used as the heat transfer fluid. Optionally, aheat transfer fluid with electrical conductivity may be used in theimmersion cooling equipment; however, in that application, the cooledelectronic equipment or devices should be hermetically sealed.

Conventionally, immersion cooling may take place in an immersion coolingtank or bath that may be sealed or semi-open. In some applications, itis preferred that the bath be hermetically sealed to prevent the escapeand loss of heat transfer fluid vapor into the environment. Furthermore,heat transfer fluid may be expensive to replace.

Problematically, maintenance of the electronic or electric equipment ordevices may be required from time to time, which is further complicatedwith a sealed bath that does not allow easy access to the electronics orelectric equipment inside. For this reason, in some applications, asemi-open or selectively sealable bath may be preferred. Advantageously,a semi-open or a selectively sealable bath enables users to hot swapelectronic or electric equipment or devices from the immersion coolingtank. In some applications, hot swap may refer to disconnecting (and/orreconnecting) some electronic or electric equipment or devices containedin an immersion cooling tank while other electronic or electricequipment or devices contained in the same immersion cooling tankcontinue to operate. As previously mentioned, however, the semi-open orselectively sealable bath may release heat transfer fluid vapor into theenvironment.

Alternative approaches to hot swapping provide unsatisfactory orunacceptable consequences. For example, the electronic or electricequipment or devices may be turned off so that the heat generated bytheir operation does not produce heat transfer fluid vapors to escapeinto the environment. This approach, however, may result in anundesirable loss of productivity and an unacceptable down time. Insteadof being turned off, the electronic or electric equipment or devicesalso may be operated, such that the heat generated is insufficient toboil the heat transfer fluid, transforming the heat transfer fluid intoa heat transfer fluid vapor. This approach also may result in anundesirable loss of productivity and an unacceptable down time.

Yet another approach may involve operating a main condenser, on whichthe heat transfer fluid vapor condenses, e.g., constantly or for anextended time, at a much lower temperature than the boiling point of theheat transfer fluid, to promote maximum condensation of the heattransfer fluid vapor. This technique is undesirably (energy)inefficient.

In still another approach, the loss of heat transfer fluid vapor may bereduced by employing a condenser configured to include multiple levelsof, e.g., two or three, condensing coils, one coil atop another coil.

SUMMARY OF THE INVENTION

In some embodiments, the purpose of the present invention is to providean apparatus for hot swapping electronic or electrical equipment ordevices from an immersion cooling tank containing a boiling heattransfer fluid that reduces the loss of heat transfer fluid vapor intothe environment.

In some applications, some or all of the heat transfer fluid vaporproduced inside an immersion cooling tank may be removed by a maincondenser running coolant at a temperature proximate or similar to roomtemperature. In other applications, some or all of the heat transferfluid vapor produced inside an immersion cooling tank may be transportedaway actively or passively to a heat exchanger system separated from theimmersion cooling tank, such that there is no main condenser inside.

In a first aspect, the present invention relates to a device for hotswapping one or more electronic devices from an immersion cooling tankhaving a first opening. In some embodiments, the device includes acondensing device, removably locatable in the first opening of theimmersion cooling tank, the condensing device having a condensing coilforming a second opening through which the electronic device(s) isremovable; and an apparatus (e.g., a crane) coupled to the condensingdevice for selectively adjusting a height and/or a location of thecondensing device about the first opening of the immersion cooling tank.In some implementations, the condensing device may further include anouter rim portion connected to a topmost portion of the condensing coil.In some applications, an outer peripheral surface of the condensing coilmay be adapted to fit within an inner peripheral surface of theimmersion cooling tank. Alternatively, in another application, one ormore of the outer peripheral dimensions of the outer rim portion of thecondensing device may be larger than one or more of the inner peripheraldimensions of the immersion cooling tank.

In some applications, the crane may include a lifting arm for adjustingthe height of the condensing device, a movable platform operativelycoupled to the lifting arm for adjusting the location of the condensingdevice, and a plurality of casters operatively coupled to a bottomportion of the movable platform for positioning the movable platform. Insome variations, the crane may be integrated into a movable device suchas a self-powered device, an externally powered device, a forklift, anda truck.

In some embodiments, the device may also include one or more of: acoolant container in fluid communication with the condensing device, achiller pump for circulating a coolant fluid from the coolant containerto the condensing device, an item lock selectively attachable to theelectronic device(s), and an apparatus for adjusting a height of theitem lock, e.g., a pulley system. In some implementations, the pulleysystem may include a plurality of sheaves, a winch (e.g., ahand-operated winch or a motor-driven winch), and a hoist wire disposedthrough sheaves and having a proximal end operatively attached to thewinch and a distal end operatively attached to the item lock.Alternatively, the apparatus for adjusting the height of the item lockmay include a chain hoist/forklift assembly or a belt-drive/forkliftassembly. In some implementations, the chain hoist/forklift assembly mayinclude a number of gear-wheels operatively coupled to a winch and aboutwhich a roller chain, to which a mounting bracket may be coupled, mayrevolve.

In a second aspect, the present invention relates to a method of hotswapping one or more electronic devices from an immersion cooling tankhaving a first opening. In some embodiments, the method may includeproviding a condensing device having a condensing coil forming a secondopening, selectively adjusting a height and a location of the condensingdevice about the first opening of the immersion cooling tank, insertingan item lock into the immersion cooling tank through the second opening,and removing, with the item lock, the electronic device(s) from theimmersion cooling tank via the second opening. In some variations, thesecond opening is smaller than the first opening.

In some implementations, selectively adjusting the height and thelocation of the condensing device may include using a crane andinserting the item lock may include using a pulley system to at leastone of raise and lower the item lock.

In a third aspect, the present invention relates to a condensing devicefor use in hot swapping one or more electronic devices from an immersioncooling tank having a first opening, In some embodiments, the condensingdevice includes a condensing coil (e.g., a layered coil, such that at anupper coil is located atop a lower coil) forming a second openingthrough which the electronic device(s) is removable. In someimplementations, the condensing device may include an outer rim portionconnected to a topmost portion of the condensing coil. Moreover, in somevariations, one or more of the outer peripheral dimensions of the outerrim portion is larger than one or more of the inner peripheraldimensions of the immersion cooling tank.

In some implementations, the condensing device may include one or moreof: a connection device (e.g., a pair of lifting shackles) forreleasably attaching the condensing coil to a lifting device and/or aplurality of attaching devices located on the outer rim portion forreleasably attaching the outer rim portion to the immersion coolingtank. In further embodiments, the condensing device may be directly andfixedly attached to at least one of the lifting device and a pluralityof attaching devices.

BRIEF DESCRIPTION OF THE DRAWINGS

In the drawings, like reference characters generally refer to the sameparts throughout the different views. Also, the drawings are notnecessarily to scale, emphasis instead generally being placed uponillustrating the principles of the invention. In the followingdescription, various embodiments of the present invention are described.

FIG. 1A is a side view of a first embodiment of a device for hotswapping an object, in which the condensing device is positioned abovean immersion cooling tank containing the object, in accordance with someembodiments of the present invention;

FIG. 1B depicts a detail of an illustrative embodiment of the condensingdevice in FIG. 1A;

FIG. 2 depicts a front view of an illustrative embodiment of araising/lowering portion of the device depicted in FIG. 1A, inaccordance with some embodiments of the present invention;

FIG. 3A depicts a side view of the device depicted in FIG. 1A, in whichthe condensing device is positioned at the opening of and within theimmersion cooling tank, in accordance with some embodiments of thepresent invention;

FIG. 3B depicts an alternative side view of the device depicted in FIG.1A, in which the condensing device is positioned at the top of theopening of the immersion cooling tank using a flange formed about theouter peripheral edge of the outer rim portion of the condensing device,in accordance with some embodiments of the present invention;

FIG. 3C depicts yet another side view of the device depicted in FIG. 1A,in which the condensing device includes a flange that rests atop theouter rim of the immersion cooling tank, in accordance with someembodiments of the present invention;

FIG. 3D depicts yet another side view of the device depicted in FIG. 1A,in which the condensing device includes a chamfered edge that is adaptedto position the condensing device above the opening of the immersioncooling tank, in accordance with some embodiments of the presentinvention;

FIG. 4 is a side view of the device depicted in FIG. 1A, in which thecondensing device is positioned within the immersion cooling tank andthe item lock has been lowered into the immersion cooling bath and iscoupled to the object to be removed, in accordance with some embodimentsof the present invention;

FIG. 5 is a side view of the device depicted in FIG. 1A, in which thecondensing device is positioned within the immersion cooling tank and anobject connected to the item lock has been raised out of the immersioncooling tank, in accordance with some embodiments of the presentinvention;

FIG. 6 depicts an isometric view of a second embodiment of a device forhot swapping an object using a hook as the item lock, in accordance withsome embodiments of the present invention;

FIG. 7A depicts a side view of the device of FIG. 6, in which thecondensing device has been lowered into the immersion cooling tank, inaccordance with some embodiments of the present invention;

FIG. 7B depicts a detail of an embodied method of securely attaching thecondensing device of FIG. 7A to a flange about the rim of the opening ofthe immersion cooling tank, in accordance with some embodiments of thepresent invention;

FIG. 8 depicts the device of FIG. 6 in which the hook is coupled to alifting lug on the object to be removed from the immersion cooling tank,in accordance with some embodiments of the present invention;

FIG. 9 depicts the device of FIG. 6 in which the hook and object havebeen removed from the immersion cooling tank, in accordance with someembodiments of the present invention;

FIG. 10 depicts a side view of a third embodiment of a device for hotswapping an object that includes a clevis as the item lock and a chainhoist for adjusting the height of the object to be removed, inaccordance with some embodiments of the present invention;

FIG. 11 depicts the device shown in FIG. 10, in which the clevis iscoupled to a lifting lug on the object to be removed from the immersioncooling tank, in accordance with some embodiments of the presentinvention;

FIG. 12 depicts the device shown in FIG. 10, in which the clevis andobject have been raised from the immersion cooling tank, in accordancewith some embodiments of the present invention;

FIG. 13 depicts an isometric view of a fourth embodiment of a device forhot swapping an object that includes a hook as the item lock and thattransports the condensing device along rails mounted to the ceiling, inaccordance with some embodiments of the present invention;

FIG. 14 depicts an isometric view of a fifth embodiment of a device forhot swapping an object that includes a hook as the item lock and thattransports the condensing device along rails mounted to the ground, inaccordance with some embodiments of the present invention;

FIG. 15 depicts an isometric view of a sixth embodiment of a device forhot swapping an object that includes a hook as the item lock and thattransports the condensing device along rails mounted to the immersioncooling tank, in accordance with some embodiments of the presentinvention;

FIG. 16A depicts an isometric view of a seventh embodiment of a devicefor hot swapping an object that includes a hook coupled to a vibratorymotor as the item lock and a condensing device that is mounted to theinterior of the immersion cooling tank, in accordance with someembodiments of the present invention;

FIG. 16B depicts a detail of the item lock depicted in FIG. 16A, inaccordance with some embodiments of the present invention;

FIG. 17A depicts an isometric view of an eighth embodiment of a devicefor hot swapping an object that includes an adjustable condensing devicehaving an adjustable opening size, in accordance with some embodimentsof the present invention;

FIG. 17B depicts a detail of the adjustable condensing device depictedin FIG. 17A, in a minimum opening mode that includes gaps betweenC-shaped potions, in accordance with some embodiments of the presentinvention;

FIG. 17C depicts a detail of the adjustable condensing device depictedin FIG. 17A, in a maximum opening mode that includes gaps betweenC-shaped potions, in accordance with some embodiments of the presentinvention;

FIG. 17D depicts a detail of the adjustable condensing device depictedin FIG. 17A, in which the condenser assemblies overlap each other, inaccordance with some embodiments of the present invention;

FIG. 17E depicts a detail of the adjustable condensing device depictedin FIG. 17A, in a maximum opening mode that includes L-shaped potionsand touching end pieces, in accordance with some embodiments of thepresent invention;

FIG. 17F depicts a detail of the adjustable condensing device depictedin FIG. 17A, in in a minimum opening mode that includes L-shaped potionsand touching end pieces, in accordance with some embodiments of thepresent invention;

FIG. 17G depicts an isometric view of a ninth embodiment of a device forhot swapping an object that includes opening covers having adjustableopening sizes, in accordance with some embodiments of the presentinvention; and

FIG. 18 is a flow chart of an exemplary method of hot swapping an objectfrom an immersion cooling tank in accordance with some embodiments ofthe present invention.

DETAILED DESCRIPTION

Referring to FIGS. 1A through 3A, an illustrative first embodiment of adevice 100 for hot swapping an object 125, e.g., electronic or electricequipment or device, from an immersion cooling tank 130 containing abath of a heat transfer fluid 135 is depicted. Advantageously, some orall of heat transfer fluid vapor 140 produced inside the immersioncooling tank 130 may be condensed and returned to the immersion coolingtank 130 using a (e.g., main) condenser 101 that is selectivelylocatable within, at, on, or above the immersion cooling tank 130 andthat is, further, structured and arranged to circulate a coolant atdesired temperature (e.g., at room temperature). In another application,some or all of heat transfer fluid vapor 140 produced inside theimmersion cooling tank 130 may be transported away actively or passivelyto a heat exchanger system that is located separate from the immersioncooling tank 130, so that there is no (e.g., main) condenser 101disposed within the opening of the immersion cooling tank 130.

In some embodiments, the device 100 may include a (e.g., main)condensing device 101 that is releasably coupled to an apparatus 102 forselectively adjusting the height (z-direction) and the location (x- andy-directions) of the condensing device 101 with respect to an openingprovided in the immersion cooling tank 130.

In one implementation, the apparatus 102 for selectively adjusting theheight and location of the condensing device 101 may consist of orconsist essentially of a crane having a vertical support portion 103, aboom portion 104, and a raising/lowering portion 105. In somevariations, the condensing device 101 may be configured to be releasablyattachable to a distal end of the raising/lowering portion 105, suchthat translation of the raising/lowering portion 105 may be accompaniedby a raising or lowering of the condensing device 101 (e.g., in az-direction).

In some implementations, the boom portion 104, at its proximal end, maybe hingedly coupled to the vertical support portion 103 and, at itsdistal end, may be hingedly coupled to the raising/lowering portion 105.A lifting arm 106, e.g., an hydraulic cylinder, may be hingedly coupled(e.g., at its proximal end) to the vertical support portion 103, e.g.,at about the mid-span or mid-length of the vertical support portion 103,and may be hingedly coupled (e.g., at its distal end) to the boomportion 104, such that operation of the lifting arm 106 may cause theboom portion 104 to rotate about the hinge at the vertical supportportion 103. Advantageously, rotation of the boom portion 104 about thehinge at the vertical support portion 103 may cause the raising/loweringportion 105 to translate in a z-direction, e.g., up or down with respectto a planar (e.g., an xy-plane) surface, e.g., the floor. Rotation ofthe boom portion 104 about the hinge with the vertical support portion103 may also result in some positional movement of the condensing device101 in the horizontal or x-direction.

In some implementations, the vertical support portion 103 of the cranemay be fixedly attached to a platform 107 operatively coupled to adevice(s) 108 for positioning the platform 107 relative to the immersioncooling tank 130. Although FIG. 1A depicts the platform 107 as a cartand the positioning device 108 as a plurality of casters or wheels, thisis done for the purpose of illustration rather than limitation. Thoseskilled in the art can appreciate that a myriad of devices andapparatuses may be used for moving the device 100 in an xy-plane toposition the condensing device 101 at a desired location above thexy-plane, e.g., above an opening in the immersion cooling tank 130. Suchdevices 108 may be motorized, self-propelled, and/or powered externally.Exemplary movable platforms may include, for the purpose of illustrationrather than limitation, a truck, a forklift, and so forth.

As shown in FIG. 2, in some applications, the raising/lowering portion105 may consist of or consist essentially of a first vertical arm 109 aand a second vertical arm 109 b that are each fixedly attached to acrossbeam 109 c that is hingedly attached to the boom portion 104, suchthat movement (e.g., rotation) of the boom portion 104 causes rotationabout the hinge connecting the crossbeam 109 c, which results in avertical (e.g., up/down) translation of the raising/lowering portion 105and a corresponding raising/lowering of the condensing device 101.Advantageously, the first vertical arm 109 a, the second vertical arm109 b, and the crossbeam 109 c are structured and arranged to providetherebetween an opening 110 dimensioned to accommodate an item lock 126,as well as the object 125 to be hot swapped. The free ends of each ofthe first 109 a and second vertical arms 109 b (i.e., the ends of thevertical arms 109 a, 109 b that are not fixedly attached to thecrossbeam 109 c) may be configured to include a respective attachingdevice 111 a, 111 b for releasably attaching the first 109 a and secondvertical arms 109 b to corresponding connection devices 123 a, 123 bfixedly attached to the condensing device 101. For example, therespective attaching devices 111 a, 111 b on the vertical arms 109 a,109 b may include openings or holes that may be aligned with openings inthe corresponding connection devices 123 a, 123 b. In someimplementations, a pin, bolt, cotter pin, and the like may be insertedinto or through the aligned openings in the attaching devices 111 a, 111b of the first 109 a and second vertical arms 109 b and thecorresponding connection devices 123 a, 123 b attached to the condensingdevice 101 to releasably attach the raising/lowering portion 105 to thecondensing device 101.

In some implementations, in addition to supporting the apparatus 102 forselectively adjusting the height and location of the condensing device101, the platform 107 may also support a coolant system 112 forproviding, forcing, and/or pumping a cooling fluid (e.g., water,coolant, Freon, and so forth) through the condensing device 101 for thepurpose of causing heat transfer fluid vapor to condense on an exteriorsurface of the condensing device 101. In some embodiments, the coolantsystem 112 may include a coolant container 113, a chiller pump 114, acoolant deliver conduit 115, and a coolant return conduit 116. In somevariations, the coolant container 113 provides a reservoir containing avolume of fluid coolant and is configured to be in fluid communicationwith, so as to provide fluid coolant to, the chiller pump 114 (e.g., viaa fluid conduit 117), as well as with a coolant return conduit 116. Thechiller pump 114 may be configured to be in fluid communication with thecoolant container 113 and the coolant delivery conduit 115. The coolantdelivery conduit 115 and the coolant return conduit 116 may be in fluidcommunication with the condensing coils 118 of the condensing device101. For such an embodiment, the upper condensing coil 118 has an inletand an outlet (attached to the coolant delivery conduit 115 and thecoolant return conduit 116, respectively) and all of the condensingcoils 118 provide fluid communication between the inlet and outlet. Insome implementations, in operation, the chiller pump 114 extracts fluidcoolant from the coolant container 113 via the fluid conduit 117,forcing the fluid coolant serially through the coolant delivery conduit115, the condensing device 101, the coolant return conduit 116, and backinto the coolant container 113.

Advantageously, in some variations, the chiller pump 114 may selectivelyand actively control the flow rate of the fluid coolant and the coolantcontainer 113 may selectively and actively control the temperature ofthe fluid coolant. Controlling the temperature and flow rate of thefluid coolant may enable the user to control the rate and degree ofcondensation of the heat transfer fluid vapor 140 on the exteriorsurface of the coils 118 of the condensing device 101.

In some embodiments, as depicted in the drawings, the condensing device101 may consist of or consist essentially of a condensing coil(s) 118that is configured to have a shape and to provide an opening 119. Theshape and dimensions of the condensing device 101 and the condensingcoil 118 may be selected or designed, such that the shape and dimensionare consistent with those of the immersion cooling tank 130. Morespecifically, the shape and dimension of the condensing device 101 andthe condensing coil 118 may be selected so that, the condensing coil 118may be inserted into, at, or above the opening of the immersion coolingtank 130 with sufficient clearance, e.g., a gap, between an outerperipheral surface of the condensing coil 118 and the inner peripheralsurface of the immersion cooling tank 130 to prevent or minimizefrictional resistance when the condensing coil 118 are inserted into theopening of the immersion cooling tank 130. The size and shape of theopening 119 in the condensing device 101 may also be dimensioned toenable a user to remove any piece of electronic or electric equipment ordevice 125 immersed in the heat transfer fluid bath 135.

Although FIGS. 1A and 1B depict a rectangular or substantiallyrectangular condensing device 101 for use with a rectangular orsubstantially rectangular immersion cooling tank 130, those of ordinaryskill in the art can appreciate that this is done for illustrativepurposes only. Indeed, the shape of the immersion cooling tank 130 andthe shape of the corresponding condensing device 101 and condensingcoils 118 may be square, circular, substantially circular, elliptical,substantially elliptical, and so forth.

In some embodiments, the condensing coil 118 may include a coil conduitthat is configured in a (e.g., rectangular, circular, elliptical, and soforth) shape having multiple layers of tubing atop one another. In somevariations, the condensing device 101 may also include an outer rimportion 120 that may be fixedly or releasably attached to the condensingcoil 118. For example, in some variations, the condensing coils 118 maybe fixedly or releasably attached to the (e.g., bottom surface of the)rim portion 120 using a plurality of holding elements 124 (e.g., metalstraps), as shown in FIGS. 1A and 3A. In other variations, thecondensing coils 118 may be fixedly or releasably attached to the boomportion 104 of the crane directly.

The inner peripheral surface of the outer rim portion 120 may bedimensioned to correspond to the size and shape of the opening 119 inthe condensing device 101. The outer peripheral edge 121 of the outerrim portion 120 may be dimensioned to extend beyond or past the largestdimension of the inner peripheral surface of the opening in theimmersion cooling tank 130, so that, when the condensing device 101 isproperly installed, the outer rim portion 120 covers, substantiallycovers, or partially covers at least some portion of the rim and/oropening of the immersion cooling tank 130. Such coverage provides atemporary seal to prevent or minimize heat transfer fluid vapor 140 fromescaping from the immersion cooling tank 130, e.g., while an object 125is being removed from or being placed into the immersion cooling tank130. Alternatively, the dimensions (e.g., length and width,circumferential, and so forth) of the outer peripheral edge 121 of theouter rim portion 120 may be dimensioned to be slightly less than thecorresponding dimensions of the inner peripheral surface of the openingin the immersion cooling tank 130, such that the condenser 101 fitswithin the immersion cooling tank 130, providing a tight fit within theopening in the immersion cooling tank 130.

In some embodiments, a pair of connecting devices 123 a, 123 b, e.g.,lifting shackles, may be fixedly attached to an upper surface 122 of theouter rim portion 120. As shown in FIGS. 2 and 3A, each of the pair ofconnecting devices 123 a, 123 b may be configured to releasably connectto a respective attaching device 111 a, 111 b of a corresponding firstor second vertical arm 109 a, 109 b of the raising/lowering portion 105.

In some variations, the outer rim portion 120 may include an outer lipor flange portion that is structured and arranged to extend beyond anddown some portion of the outer peripheral surface of the immersioncooling tank 130. The outer lip or flange portion provides a furtherseal to prevent or minimize heat transfer fluid vapor 140 escaping fromthe immersion cooling tank 130. Optionally, the outer lip or flangeportion may provide a platform for an attaching device that may be usedfor releasably attaching the condensing device 101 to the immersioncooling tank 130. Exemplary attaching devices, for the purpose ofillustration rather than limitation, may include mechanical quickconnection devices (e.g., a snap catch, a locking detainer, and soforth).

Various embodiments for positioning the condensing device 101 at orabout the opening of the immersion cooling tank 130 are shown in FIGS.3B through 3D. Whereas the embodiment shown in FIG. 3A depicts thecondensing device 101 that is completely or substantially disposedwithin the immersion cooling tank 130, the immersion cooling tanks 130shown in the embodiments shown in FIGS. 3B through 3D may only bepartially disposed within the immersion cooling tank 130. For example,the embodiment shown in FIG. 3B includes a flange 138 formed about theouter peripheral edge 121 of the outer rim portion 120. Advantageously,the flange 138 and outer peripheral edge 121 are configured such thatthe flange 138 rests on the outer rim of the immersion cooling tank 130.As shown in FIG. 3B, all or some portion of the condensing device 101may extend into the opening of the immersion cooling tank 130.Optionally, the condensing device 101 may be adapted such that the coils118 remain above the opening of the immersion cooling tank 130.

In the alternative, the embodiment shown in FIG. 3C includes a flange137 formed at the opening of the outer rim portion 120. Advantageously,the flange 137 may be configured such that the flange 137 rests atop theouter rim of the immersion cooling tank 130. As shown in FIG. 3C, thecondensing device 101 is disposed substantially out of and above theimmersion cooling tank 130 and may be structured and arranged topartially or completely cover the opening in the immersion cooling tank130. Optionally, the condensing device 101 may be adapted such that someof the coils 118 extend into the opening of the immersion cooling tank130.

In yet another alternative embodiment, as shown in FIG. 3D, the outerrim portion 120 of the condensing device may include a chamfered edge orportion 136. Advantageously, the chamfered edge 136 may be configured,such that all or some portion of the chamfered portion 136 fits withinthe opening of the immersion cooling tank 130. In some variations, themeshing of the chamfered portion 136 and the immersion cooling tank 130may be adapted such that the condensing device 101 remains above andcompletely outside of the immersion cooling tank 130. Optionally, thecondensing device 101 having a chamfered edge 136 may be configured sothat a few of the coils 118 extend into the immersion cooling tank whenthe chamfered edge 136 is inserted into the immersion cooling tank 130.Advantageously, the condensing device 101 may fully (e.g., so as toseal) or only partially cover the opening of the immersion cooling tank130.

In some variations, as shown in FIGS. 4-7B, an attaching system mayinclude position locks 131 that are disposed in sliding tracks 132formed in the outer rim portion 120. For the purpose of illustration,rather than limitation, the attaching system may include a plurality of(e.g., four) translatable position locks 131 that are structured andarranged with a notched end for the purpose of releasably securing theposition locks 131 and the condensing device 101 to a flanged portion133 formed about the outer rim at the opening of the immersion coolingtank 130. As shown in FIG. 6, position locks 131 are slidingly attachedto the outer rim portion 120 at the sliding tracks 132. In operation,after the condensing device 101 has been lowered into the immersioncooling tank 130, the position locks 131 may be (e.g., manually orautomatically) translated towards the flanged portion 133, such that thenotch catches the flanged portion 133, preventing removal or furthermovement of the condensing device 101.

In some implementations, the embodied device 100 may also include anitem lock 126 that is releasably attachable to the object 125 immersedin the heat transfer fluid bath 135 for the purpose of removing theobject 125 from and re-installing the object 125 into the heat transferfluid bath 135. The item lock 126 may include any kind of a device(e.g., mechanical, magnetic, electrical, or a combination thereof)suitable for gripping, raising, holding, and lowering the object 125.Exemplary item locks 126, for the purpose of illustration rather thanlimitation, may include a magnet, a claw or gripper 126 (FIG. 5), a pairof grippers, a collet insert, a hook 126′ and eyebolt 134 combination(FIG. 7A), a clevis 126″ and eyebolt 134 combination (FIG. 10), and thelike.

In some implementations, the item lock 126 may be mechanically coupledto an apparatus for adjusting the height, i.e., selectively raising andlowering, of the item lock 126. For example, a hoisting or pulley systemmay include a hoist wire 127, a winch 128, and a plurality of sheaves orpulleys 129. In an illustrative embodiment, the item lock 126 may beattached to a distal end of the hoist wire 127, while the winch 128 maybe attached to a proximal end of the hoist wire 127. Between the distaland proximal ends, the hoist wire 127 may be routed through a pluralityof sheaves or pulleys 129 that provide, inter alia, mechanical advantageto the hoisting/pulley system.

The winch 128 may be manually- and/or automatically-operated to adjustthe height of the item lock 126. The item lock 126 may have aself-aligning capability to detect and clutch and/or grip the object125. Optionally, capturing and gripping of the object 125 with the itemlock 126 may be implemented manually by an operator. For example, theitem lock 126 may be lowered by hand but a winch motor may be engaged toraise the item lock 126 once it is attached to an object 125 in theimmersion cooling tank 130.

In some variations, as shown in FIGS. 6 through 9, the item lock may beconfigured as a hook 126′ that is structured and arranged to mesh orlock with an eyebolt 134, lifting lug, and the like that is fixedlyattached to the object 125. In operation, the hook 126′ can be lowered(e.g., manually or automatically) through the opening 119 in thecondensing device 101 into the heat transfer fluid 135 until the hook126′ catches the eyebolt 134, lifting lug, and the like. Once the hook126′ is coupled to the eyebolt 134, lifting lug, and the like, the hook126′ and item 125 may be raised out of the heat transfer fluid 135,through the opening 119 in the condensing device 101 to a desiredelevation above the immersion cooling tank 130. Once heat transfer fluid135 has been allowed to drained from the surface of the removed object125, the object 125 may be removed from the hook 126′.

In another variation, as shown in FIGS. 10 through 12, the item lock maybe configured as a clevis 126″ that is structured and arranged to meshor lock with an eyebolt 134, lifting lug, and the like that is fixedlyattached to the object 125. In operation, the clevis 126″ (with itsclevis pin removed) may be lowered (e.g., manually or automatically)through the opening 119 in the condensing device 101 into the heattransfer fluid 135 until the clevis 126″ is proximate the eyebolt 134,lifting lug, and the like. Using a clevis pin, i.e., by inserting theclevis pin in the openings provided in the clevis 126″ therefor, theclevis 126″ may then be coupled (e.g., manually or mechanically) to theeyebolt 134, lifting lug, and the like. The clevis 126″ and item 125 maythen be raised out of the heat transfer fluid 135, through the opening119 in the condensing device 101 to a desired elevation above theimmersion cooling tank 130. Once heat transfer fluid 135 has beenallowed to drained from the surface of the removed object 125, theobject 125 may be removed from the clevis 126″.

In an alternative embodiment, as shown in FIGS. 10 through 12, insteadof using a hoisting or pulley system that includes a hoist wire 127, awinch 128, and a plurality of sheaves or pulleys 129, a chainhoist/forklift 200 may be used for selectively adjusting the height andthe location of the condensing device 101, as well for selectivelyadjusting the height and location of the item lock 126 and object 125 tobe removed from/installed in the immersion cooling tank 130. In someimplementations, for the purpose of illustration rather than limitation,the chain hoist/forklift 200 may include a plurality of (e.g., two)roller chain systems or assemblies having a plurality of gear-wheels 204a, 204 b, 207 a, 207 b; roller chains 205, 208; and winches 206, 209that are structured and arranged to selectively raise and lower thecondensing device 101, the item lock 126″, and/or the object 125. Insome implementations, the roller chain 208 of the first roller chainassembly may be operatively disposed about a first (e.g., an upper) gearwheel 207 a and a second (e.g., lower) gear wheel 207 b. A winch 206,mechanically coupled to one of the gear wheels 207 a, 207 b, e.g., tothe second (e.g., lower) gear wheel 207 b, may be structured andarranged to drive the second gear wheel 207 b, causing the roller chain208 to rotate about the gear wheels 207 a, 207 b. The roller chain 205of the second roller chain assembly may be operatively disposed about afirst (e.g., an upper) gear wheel 204 a and a second (e.g., lower) gearwheel 204 b. A winch 209, mechanically coupled to one of the gear wheels204 a, 204 b, e.g., to the second (e.g., lower) gear wheel 204 b, may bestructured and arranged to drive the second gear wheel 204 b, causingthe roller chain 205 to rotate about the gear wheels 204 a, 204 b. Thefirst (e.g., upper) gear wheels 204 a, 207 a may be idle wheels or,optionally, may also be mechanically coupled to a winch.

In some applications, a first mounting bracket 201 may be coupled to theitem lock 126″ and mechanically connected to the first roller chain 208,while a second mounting bracket 202 may be coupled to the condensingdevice 101 and mechanically connected to the second roller chain 205.Each of the first roller chain 208 and the second roller chain 205 maybe independently and automatically operated to raise/lower the item lock126″ or the condensing device 101, respectively. For example, the firstwinch 206 and the first plurality (e.g., set or pair) of gear wheels 207a, 207 b may be adapted to move the first roller chain 208, such thatthe movement of the first roller chain 208 adjusts the height of itemlock 126″. The second winch 209 and the second plurality (e.g., set orpair) of gear wheels 204 a, 204 b may be adapted to move the secondroller chain 205, such that the movement adjusts the height ofcondensing device 101.

Although FIGS. 10 through 12 show an embodiment of a chainhoist/forklift 200 in which the first roller chain 208 and the secondroller chain 205 appear to be aligned, one substantially behind theother, this is done for the purpose of illustration rather thanlimitation. Indeed, in some implementations, the first roller chain 208and the second roller chain 205 may be configured in a side-by-sidearrangement. When the first roller chain 208 and the second roller chain205 are substantially aligned as shown in FIGS. 10 through 12, however,the first roller chain 208 and the second roller chain 205 should beoffset, so that the paths of the first mounting bracket 201 and thesecond mounting bracket 202 do not interfere with one another. In somevariations, a support structure 203 may be used to support the assemblyfor the second roller chain 205 and to connect the assembly for thesecond roller chain 205 to the assembly for the first roller chain 208.Optionally, instead of using a chain hoist/forklift 200, a belt drivedrive/forklift may be used in its place, positioned and operated in asimilar manner.

In an alternative embodiment, in lieu of using a mobile crane 102 toselectively adjust the height and location of a condensing device 101,the apparatus for selectively adjusting the height and location of acondensing device 101 may consist of or consist essentially of anoverhead (e.g., gantry, monorail, and so forth) crane 102′. For example,as shown in FIG. 13, the overhead crane 102′ may include a pair oftracks 141 a, 141 b that are fixedly attached to a structure that iscapable of supporting the weight of the crane 102′, the condensingdevice 101, and any object(s) 125 contained in the immersion coolingtank 130. A selectively movable, motorized element 142 (e.g., a crossbeam, a gantry girder, and the like) (hereinafter referred to as the“cross beam”) may be operatively disposed on each of the tracks 141 a,141 b, such that the motorized element 142 may translate in a first(e.g., a y-axis) direction that is parallel to the longitudinal axes ofthe tracks 141 a, 141 b. A second, selectively movable, motorizedelement 143 may be operatively disposed on the cross beam 142, such thatthe second motorized element 143 may translate in a second (e.g., anx-axis) direction that is perpendicular to the longitudinal axes of thetracks 141 a, 141 b.

In some implementations, the second motorized element 143 may be furtherstructured and arranged to support a first winch assembly 144, a secondwinch assembly 145, and a coolant system 112′. The first winch assembly144 may be operatively coupled to and configured for selectivelyadjusting the height of a unit lock 126. The second winch assembly 145may be operatively coupled to one or more attaching devices 146 (e.g.,hooks, devises, and the like) that are adapted to be removablyattachable to connection devices 123 a, 123 b fixedly attached to thecondensing device 101. In some variations, the second winch assembly 145may selectively adjust the height of the attaching devices 146 via oneor more cables 147.

In some embodiments, coolant system 112′ may include a chiller pump 114′and a coolant container 113′ that are structured and arranged to providefluid coolant serially through a coolant delivery conduit 115′, thecondensing device 101, a coolant return conduit 116′, and the coolantcontainer 113′. As shown in FIG. 13, the chiller pump 114′ and coolantcontainer 113′ may be supported above the second motorized element 143on a substrate or platform.

In yet alternative embodiment, the apparatus for selectively adjustingthe height and location of a condensing device 101 may consist of orconsist essentially of a bridge-type crane 102″. For example, as shownin FIG. 14, the bridge-type crane 102″ may include a pair of tracks 151a, 151 b. A pair of selectively movable, motorized elements 154 a, 154 b(e.g., columns) may be operatively disposed on each of the tracks 151 a,151 b, such that the motorized elements 154 a, 154 b may translate in afirst (e.g., a y-axis) direction that is parallel to the longitudinalaxes of the tracks 145 a, 151 b. A selectively movable, motorizedelement 152 (e.g., a cross beam a gantry girder, and the like)(hereinafter referred to as the “cross beam”) may be operativelydisposed on each of the columns 154 a, 154 b. A second, selectivelymovable, motorized element 153 may be operatively disposed on the crossbeam 152, such that the second motorized element 153 may translate in asecond (e.g., an x-axis) direction that is perpendicular to thelongitudinal axes of the tracks 151 a, 151 b. In some implementations,the second motorized element 153 may be further structured and arrangedto support a first winch assembly 144, a second winch assembly 145, anda coolant system 112′, as previously described.

In a further embodiment, as shown in FIG. 15, the apparatus 102″′ forselectively adjusting the height and location of the condensing device101 may consist of or consist essentially of one or more lifting towers301, 302 that are configured to be movable (e.g., in a first (e.g.,y-axis) direction) along fixed rails 303. In some implementations, thefixed rails 303 may be immobile and fixedly attached to (e.g., mountedon) the immersion cooling tank 130′. Although the fixed rails 303 (inFIG. 15) only allow the lifting towers 301, 302 to move in a single(e.g., y-axis) direction, this is done for the purpose of illustrationrather than limitation. Those of ordinary skill in the art canappreciate that the fixed rails 303 could be configured to be movable inthe x-axis direction. Advantageously, for immersion cooling tanks 130″having multiple openings that are linearly aligned, such design enablesthe condensing device 101 to serve the multiple openings in theimmersion cooling tank 130′.

In some variations, a first lifting tower 301 may be structured andarranged to selectively adjust the height of the condensing device 101,while a second lifting tower 302 may be structured and arranged toadjust the height of the unit lock (e.g., hook) 126′, e.g., using anextension rod 127′. For example, the first lifting tower 301 may includean arm 309 that is removably attachable to the condensing device 101. Ahoisting or elevating system operatively disposed within the firstlifting tower 301 is configured to raise and lower the arm 309, whichselectively adjusts the height or elevation of the condensing device101. In like manner, a hoisting or elevating system operatively disposedwithin the second lifting tower 302 is configured to raise and lower theangled extension rod 127′. Although an angled extension rod 127′ isshown in FIG. 15, this is done for the purpose of illustration ratherthan limitation. Those of ordinary skill in the art can appreciate thatthe angled extension 127′ may be replaced with alternative raisingdevices (e.g., a flexible element, a chain, a rope, a hoist wire, andcombinations thereof), as well as a straight extension rod.

A coolant system 112″ for the embodied apparatus 102″′ may be supportedby and disposed behind the one or more lifting towers 301, 302. In somevariations, the coolant system 112″ may include a chiller pump 114″ anda coolant container 113″ that are structured and arranged to providefluid coolant from the chiller pump 114″ serially through a coolantdelivery conduit 115″, the condensing device 101, a coolant returnconduit 116″, and the coolant container 113″.

As shown in FIG. 16A, in another embodiment, condensing devices 101′ maybe removably attached or permanently attached to the immersion coolingtank 130′ within a corresponding opening. The apparatus 102 ^(iv) forselectively adjusting the height of the item lock 304 may consist of orconsist essentially of a lifting tower 302 installed on the immersioncooling tank 130′, proximate the opening in the immersion cooling tank101′, in combination with an angled extension rod 127′. For example, thecondensing device 101′ may be mounted inside the immersion cooling tank130′, e.g., using a set of mounting brackets. Alternatively, thecondensing device 101′ may be welded to the internal wall of theimmersion cooling tank 130′. In some variations, the immersion coolingtank 130′ may be structured and arranged to include a mounting area forinstalling the lifting tower 302. The lifting tower 302, in turn, may befixedly or movably installed. If fixedly installed, the lifting tower302 may be configured to include a single opening within reach and everyopening may be equipped with its own lifting tower (e.g., as shown inFIG. 17A). If movably installed, the lifting tower 302 may be placed onrails so that a single lifting tower can extract devices from any of theplural openings in the immersion cooling tank 130′.

As shown in FIG. 16B, in some applications, the item lock 304 mayconsist of or consist essentially of a vibration motor 305 movably orrigidly attached to a hook 126′. In operation, the vibration motor 305produces vibration, for example, by rotating an unbalanced rotor.Advantageously, the vibration motor 305 may be turned ON before orduring lifting of an object 125 to assist the draining of dielectricliquid from the object 125 back to the immersion cooling tank 130′.Although an unbalanced rotor-type vibration motor 305 is shown in FIG.16B, this is done for the purpose of illustration rather thanillustration. Indeed, those of ordinary skill in the art can appreciatethat any device that is capable of producing vibrations (e.g., apiezoelectric device, an electro-magnetic device, and the like) may beused to promote drainage of dielectric fluid.

In some variations, a coolant system 112″′ for the embodied apparatus102 ^(iv) may be disposed proximate the immersion cooling tank 130′, forexample, at one end of the immersion cooling tank 130′. In somevariations, the coolant system 112″′ may include a chiller pump 114″′and a coolant container 113″′ that are structured and arranged toprovide fluid coolant from the chiller pump 114″′ serially through acoolant delivery conduit 115″′, one or more condensing devices 101′, acoolant return conduit 116″′, and the coolant container 113″′. Since thecondensing devices 101′ are removably attached to the immersion coolingtank 130′, all or some portions of the coolant delivery conduit 115″′and the coolant return conduit 116″′ may also be removably orpermanently attached to the immersion cooling tank 130′. Moreover, thecoolant delivery conduits 115″′ to the individual condensing devices101′ may be fluidically coupled to each other in series and the coolantreturn conduit 116″′ from the individual condensing devices 101′ may befluidically coupled to each other in series.

FIGS. 17A through 17G depict variations to the apparatus 102 ^(v) shownin FIG. 16A. Heretofore, a condensing device 101 having a fixed size anddimensions has been described for use. However, in an alternativeembodiment, to allow for more efficient condensation of dielectric vaporlocated on the extracted electronic device 125, the size of the openingof the condensing device 101″ may be selectively adjusted (e.g., basedon the size of the electronic device 125 to be extracted therethrough)to a cross-sectional area between a minimum opening size and a maximumopening size. For example, if the electronic device 125 includes asingle rack unit (i.e., “1U”), then the size of the opening in thecondensing device 101″ may be selectively altered (e.g., manually orautomatically) to correspond to an opening size at or near its minimumopening size (FIG. 17B). In some implementations, the coolant lines areat their natural lengths when the condensing device is at minimumopening size. Thus, when the coolant lines are flexibly extended, thecondensing device would be at maximum opening size. Alternatively, thecoolant lines could also at its natural length when the condensingdevice is at maximum opening, then the coolant line could be curled intoroll(s) when the condensing device is at minimum opening size.Alternatively, if another electronic device 125′ includes 4 rack units(“4U”), the size of the opening of the condensing device 101″′ may beselectively adjusted (e.g., manually or automatically) to correspond toan opening size that is at or near its maximum opening size (FIG. 17C).

As alternatives to the minimum and maximum opening sizes depicted inFIGS. 17B and 17C, respectively, instead of the condensing device 101″′having C-shaped halves with gaps or openings between the ends of theC-shaped halves in its minimum opening configuration (FIG. 17B), in analternative embodiment, the gaps may be eliminated, such that opposingL-shaped halves touch each other at the maximum opening size (FIG. 17F).Moreover, instead of the condensing device 101″′ having C-shaped halveswith gaps or openings between the ends of the C-shaped halves in itsmaximum opening configuration (FIG. 17C), in an alternative embodiment,the gaps may be eliminated, such that opposing L-shaped halves toucheach other at the maximum opening size (FIG. 17E). In some variations, a(e.g., elastic) thermally-conductive material 308 (e.g.,thermo-conductive rubber and the like) may be used in instances in withthe condensing devices 101″, 101″′ touch each other at both maximum orminimum opening sizes.

As shown in FIG. 17D, for condensing devices 101″′ that touch each otherat maximum opening, for such a condensing device 101″′ to be selectivelyadjusted to correspond to its minimum opening size, one or both of theopposing L-shaped halves of the condensing device 101″′ must be moved,such that some thermally-conductive elements 308 a protrude past theother thermally-conductive elements 308 b. Typically, the coolant linesmay comprise flexible hoses (e.g., rubber, plastic, and the like), whichare adapted to stretch and deform around the thermally-conductiveelements. Alternatively, the distance between the coolant linessupplying the thermally-conductive elements 308 b could be larger thanthe height of the thermally-conductive elements 308 a, so that thethermally-conductive elements 308 a can pass through thethermally-conductive elements 308 b without interference.

Optionally, as shown in FIG. 17G, a covering sheet 306, 306′ of covermay be used to cover an unused portion of an opening in the immersioncooling tank 130′, for example, to reduce fluid vapor loss.Advantageously, a plurality of covering sheets 306, 306′ having variableor fixed size openings 307, 307′ may be used. The cover 306′ having amaximum size opening 307′ may allow 4U devices to pass through, whilethe cover 306 having a minimum size opening 307 may only allow 1Udevices to pass through. Those of ordinary skill in the art canappreciate that the opening size may be selected to allow devicessmaller than 1U and larger than 4U to pass through them, as well as toallow devices larger than 1U but smaller than 4U.

Having described a device for hot swapping electronic or electricequipment of devices from a heat transfer fluid bath of an immersioncooling system, a method of hot swapping electronic or electricequipment of devices from a heat transfer fluid bath of an immersioncooling system will now be described. Advantageously, the embodied hotswapping method may occur while other electronic or electric equipmentor devices contained in the immersion cooling bath continue to operate,to generate heat, and to cause heat transfer fluid to vaporize.

Referring to the exemplary flow chart in FIG. 18, initially, while theimmersion cooling tank is still covered, the device may be positioned,e.g., using the movable platform and/or the lifting arm, such that thecondensing device is aligned with the opening of the immersion coolingtank (STEP 1). FIGS. 1A and 6 depict the device positioning and aligningthe condensing device about the opening of the immersion cooling tank.Contemporaneously with positioning and aligning the condensing device(STEP 1), the chiller pump may be activated to initiate the flow offluid coolant through the condensing device, e.g., the condensing coil(STEP 2). The coolant flow rate and coolant temperature may be adjustedto selectively and actively control condensation of the heat transferfluid vapor once the condensing device has been lowered proximate theopening of the immersion cooling tank (STEP 3). Those of ordinary skillin the art can appreciate that chiller pump may be activated to initiatethe flow of fluid coolant through the condensing device (STEP 2) at anytime before the item lock and object(s) to be removed and may then beraised out of the heat transfer fluid bath (STEP 5).

Once the coolant flow rate and temperature of the condensing device areat their predetermined marks, as shown in FIG. 3, the condensing devicemay be lowered into the opening of the immersion cooling tank (STEP 4).In some implementations, the condensing device may be lowered into theopening until the outer rim portion of the condensing device forms afull or a partial seal with the rim at the opening of the immersioncooling tank. In other implementations, after the condensing device hasbeen lowered into the opening of the immersion cooling tank (STEP 4), asshown in FIGS. 7A, 7B, the condensing device may be releasably attachedto a flange disposed about the rim of the immersion cooling tank, e.g.,using a snap catch, a locking detainer, a plurality of sliding positionlocks, and the like (STEP 5). Advantageously, once the outer rim portionof the condensing device forms a full or partial seal with the immersioncooling tank, the size of the opening of the immersion cooling tank hasbeen reduced to the size of the opening in the condensing coil. As aresult, not only does condensation of the heat transfer fluid vaporproximate the exterior surface of the condensing device reduce orminimize the volume of heat transfer fluid vapor capable of escapinginto the environment, but, also, the area available for heat transferfluid vapor to escape has been reduced.

In another embodiment, while the immersion cooling tank is stillcovered, the device may be positioned, e.g., using the movable platformand/or the lifting arm, such that the condensing device is aligned withthe opening of the immersion cooling tank (STEP 1). After the condensingdevice has been lowered proximate the opening of the immersion coolingtank (STEP 2) lowering the condensing device into the opening of theimmersion cooling tank (STEP 3) may be optional since it is not requiredfor condensing device designed to be placed at or above the opening ofthe immersion cooling tank. Moreover, attaching the condensing device toa flange disposed about the rim of the immersion cooling tank, e.g.,using a snap catch, a locking detainer, a plurality of sliding positionlocks, and the like, may also be optional (STEP 4).

Subsequently, an item lock may be lowered into the heat transfer fluidbath, through the opening in the condensing device, and the item lockmay be releasably attached to the object(s) to be removed from the heattransfer fluid bath (STEP 6). Lowering the item lock may be performedmanually, e.g., using a hand crank and a winch, or automatically, e.g.,using a hoisting/pulley system, chain hoist/forklift system, and soforth. FIGS. 4, 8, and 11 depict the item lock lowered into the heattransfer (dielectric) fluid bath. Connecting to and/or capturing theobject may be performed manually by an operator or by means of aself-aligning/self-adjusting capability of the item lock to detect andattach to/ clutch the object.

Once the object(s) to be removed has been captured/secured by the itemlock, the item lock and object(s) to be removed may then be raised outof the heat transfer fluid bath (STEP 7), through the opening in thecondensing device. For example, the item lock and object(s) to beremoved may be raised manually, e.g., using a hand crank and winch, orautomatically, e.g., using a hoisting/pulley system, a chainhoist/forklift system, and so forth. FIGS. 5, 9, and 12 depict the itemlock and removed object raised out of the heat transfer fluid bath. Onceheat transfer fluid on the exterior surface of the object to be removedhas been allowed to drain back into heat transfer fluid bath in theimmersion cooling tank, the object(s) may then be released from the itemlock and retrieved or removed.

To reinstall the removed object(s) and/or to insert a replacementobject(s) in its place, either procedure described hereinabove may bereversed. Using the exemplary method, for example, the replacementobject(s) may be attached to the item lock. The item lock andreplacement object(s) may then be lowered into the heat transfer fluidbath, through the opening in the condensing device. For example,lowering may be performed manually, e.g., using a hand crank and awinch, or automatically, e.g., using the hoisting/pulley system, thechain hoist/forklift system, and so forth. Once the replacementobject(s) is correctly positioned, the item lock may release thereplacement object(s) and the item lock may be removed from the heattransfer fluid bath, through the opening in the condensing device. Forexample, the item lock and object may be raised manually, e.g., using ahand crank and a winch, or automatically, e.g., using thehoisting/pulley system, the chain hoist/forklift system, and so forth.

Once the item lock has been raised sufficiently to clear the opening inthe condensing device, the condensing device may be raised, e.g., usingthe lifting device, from the opening of the immersion cooling tank.Alternatively, the item lock and the condensing device may be raisedsimultaneously. The immersion cooling tank may then be re-covered.

The invention may be embodied in other specific forms without departingfrom the spirit or essential characteristics thereof. The foregoingembodiments, therefore, are to be considered in all respectsillustrative rather than limiting the invention described herein. Scopeof the invention is thus indicated by the appended claims, rather thanby the foregoing description, and all changes that come within themeaning and range of equivalency of the claims are intended to beembraced therein.

What is claimed is: 1-27. (canceled)
 28. A condensing device for use inhot swapping at least one electronic device from an immersion coolingtank having a first opening, the condensing device comprising acondensing coil forming a second opening through which the at least oneelectronic device is removable.
 29. The condensing device of claim 28further comprising an outer rim portion connected to the condensingcoil.
 30. The condensing device of claim 29, wherein at least one outerperipheral dimension of the outer rim portion is larger than at leastone inner peripheral dimension of the immersion cooling tank.